Damage assessment of human health for lead-free solder based on endpoint-type LCIA methodology

被引：1
|
作者：
Itsubo, N
Noh, J
Hayashi, K
Inaba, A
机构：
来源：
2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03 | 2003年
关键词：
D O I：
10.1109/VETECF.2003.239801
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
引用
收藏
页码：836 / 837
页数：2
相关论文
共 50 条
  • [21] Phase stability assessment and microstructure modification at lead-free solder joint
    Gao, F.
    Nishikawa, H.
    Takemoto, T.
    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 738 - +
  • [22] Thermodynamic assessment of the Sn-Co lead-free solder system
    Liu, LB
    Andersson, C
    Liu, J
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (09) : 935 - 939
  • [23] Thermodynamic assessment of the Sn-Co lead-free solder system
    Libin Liu
    Cristina Andersson
    Johan Liu
    Journal of Electronic Materials, 2004, 33 : 935 - 939
  • [24] Reliability assessment for micro lead-free solder joints in electronics package
    Yu, Q
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1055 - 1058
  • [25] Analysis of lead-free solder paste based on performance degradation
    Li, Cui
    Lei, Yongping
    Lin, Jian
    Tian, Ye
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 375 - 379
  • [26] Research Progress of Sn-based Lead-Free Solder
    Pu, Cunji
    Li, Caiju
    Peng, Jubo
    Zhang, Xin
    Guo, Shaoxiong
    Yi, Jianhong
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2023, 52 (09): : 3302 - 3315
  • [27] Research Progress of Sn-based Lead-Free Solder
    Pu Cunji
    Li Caiju
    Peng Jubo
    Zhang Xin
    Guo Shaoxiong
    Yi Jianhong
    RARE METAL MATERIALS AND ENGINEERING, 2023, 52 (09) : 3302 - 3315
  • [28] Study on local recrystallization and damage mode of Lead-free BGA solder joint
    Xu, Xing
    Chen, Gaiqing
    Cheng, Mingsheng
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 356 - 359
  • [29] Damage constitutive model and failure mechanism of lead-free solder in CBGA package
    Hao, W. N.
    Chai, G. Z.
    Zhou, J.
    MATERIALS AND PRODUCT TECHNOLOGIES, 2008, 44-46 : 77 - 83
  • [30] Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography
    Liu, Caiping
    Duan, Qingquan
    Mao, Lingtao
    NEW MATERIALS AND ADVANCED MATERIALS, PTS 1 AND 2, 2011, 152-153 : 1004 - +
12345