DESIGN OF COMPACT MIC ROWAVE DIPLEXER FOR SYSTEM-IN-A-PACKAGE APPLICATIONS

被引：0

作者：

Chen, Chi-Feng ^{[1
]}

Wang, Guo-Yun ^{[1
]}

Tseng, Bo-Hao ^{[1
]}

Lin, Ting-An ^{[1
]}

机构：

[1] Tunghai Univ, Dept Elect Engn, Taichung 40704, Taiwan

来源：

2016 IEEE INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS-TAIWAN (ICCE-TW) | 2016年

关键词：

RESONATOR;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 lambda(g) by 0.12 lambda(g). The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.

引用

页码：135 / 136

页数：2

共 50 条

[1] Design of multilayer spiral inductor resonator filter and diplexer for system-in-a-package
Lee, GA
Megahed, M
De Flaviis, F
2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2003, : 527 - 530
[2] Characterization of substrate materials for system-in-a-package applications
Chen, L
Andræ, ASG
Zou, G
JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (02) : 195 - 201
[3] Design consideration for system-in-a-package with embedded passive circuits
Lee, GA
Megahed, M
De Flaviis, F
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1678 - 1681
[4] Design and Simulation of 2.5 GHz System-in-a-Package Module
Hussein, Yasser A.
2015 IEEE 16TH ANNUAL WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE (WAMICON), 2015,
[5] Design of Miniaturized Filtering Power Dividers for System-in-a-Package
Chen, Chi-Feng
Huang, Ting-Yi
Shen, Tze-Min
Wu, Ruey-Beei
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (10): : 1663 - 1672
[6] Low-cost compact spiral inductor resonator filters for system-in-a-package
Lee, GA
Megahed, MA
De Flaviis, F
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 761 - 771
[7] Silicon sandwich [system-in-a-package]
IET Electron. Syst. Softw., 2006, 2 (34-37):
[8] Reliability modelling of embedded system-in-a-package :: Design and packaging issues
Bharatula, NB
Ossevoort, S
Lukowicz, P
Tröster, G
ESA'04 & VLSI'04, PROCEEDINGS, 2004, : 387 - 392
[9] A Compact Substrate Integrated Waveguide Diplexer Using Dual Mode Resonator as a Junction for System in Package Applications
Rezaee, Morteza
Attari, Amir Reza
ELECTROMAGNETICS, 2017, 37 (02) : 92 - 105
[10] Characterization of liquid crystal polymer for high frequency system-in-a-package applications
Zou, G
Grönqvist, H
Starski, JP
Liu, J
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (04): : 503 - 508

← 1 2 3 4 5 →