Novel Circuit-Level Model for Gate Oxide Short and its Testing Method in SRAMs

被引:4
|
作者
Lin, Chen-Wei [1 ]
Chao, Mango C. -T. [1 ]
Hsu, Chih-Chieh [2 ,3 ]
机构
[1] Natl Chiao Tung Univ, Inst Elect, Dept Elect Engn, Hsinchu 30010, Taiwan
[2] Natl Yunlin Univ Sci & Technol, Grad Sch Engn Sci & Technol, Yunlin 41349, Taiwan
[3] Natl Yunlin Univ Sci & Technol, Dept Elect Engn, Yunlin 64002, Taiwan
关键词
Defect modeling; gate-oxide short; SRAM; testing; WRITE-ABILITY; DESIGN;
D O I
10.1109/TVLSI.2013.2268984
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Gate oxide short (GOS) has become a common defect for advanced technologies as the gate oxide thickness of a MOSFET is greatly reduced. The behavior of a GOS-impacted MOSFET is, however, complicated and difficult to be accurately modeled at the circuit level. In this paper, we first build a golden model of a GOS-impacted MOSFET by using technology CAD, and identify the limitation and inaccuracy of the previous GOS models. Next, we propose a novel circuit-level GOS model which provides a higher accuracy of its dc characteristics than any of the previous models and being is able to represent a minimum-size GOS-impacted MOSFET. In addition, the proposed model can fit the transient characteristics of a GOS by considering the capacitance change of the GOS-impacted MOSFET, which has not been discussed in previous work. Last, we utilize our proposed GOS model to develop a novel GOS test method for SRAMs, which can effectively detect the GOS defects usually escaped from the conventional IDDQ test and March test.
引用
收藏
页码:1294 / 1307
页数:14
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