High-level test compaction techniques

被引:5
|
作者
Ravi, S [1 ]
Lakshminarayana, G
Jha, NK
机构
[1] NEC Corp Ltd, C & C Res Labs, Princeton, NJ 08540 USA
[2] Alphion Corp, Eatontown, NJ 07724 USA
[3] Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA
基金
美国国家科学基金会;
关键词
D O I
10.1109/TCAD.2002.1013895
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Available register-transfer level (RTL) test generation techniques do not make a concerted effort to reduce the test application time associated with the derived tests. Chip tester memory limitations, increasing tester costs, etc., make it imperative that the issue of generating compact tests at the RTL be addressed and consolidated with the known gains of high-level testing. In this paper, the authors provide a comprehensive framework for generating compact tests for an RTL circuit. They develop a series of techniques that exploit the inherent parallelism available in symbolic test(s) derived for RTL module(s). These techniques enable them to schedule testing of multiple modules in parallel as well as perform test pipelining. In addition, the authors also present design for testability (DFT) techniques for lowering test application time. Using a maximum bipartite matching formulation, they choose a low-overhead set of test enhancements that can achieve compact tests. The authors' techniques can seamlessly plug into any, generic high-level test framework. Their experimental results in the context of one such framework indicate that the proposed methodology achieves an average reduction in test application time of 54.2% for the example circuits.
引用
收藏
页码:827 / 841
页数:15
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