The hot-carrier effects of non-planar tri-gate SOI FET (TGFET) with back-gate bias were investigated. Negative back gate bias could raise the influence of buried oxide defects and then degrade the device quickly. For TGFETs with ultra-narrow fin width and side gate extension, the smaller buried oxide interface area and more obvious screening effect terminate the field lines to obviate the back gate bias efficiently. The extrapolated hot-carrier lifetime encourages the TGFETs as promising sub-10nm devices.
机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Zhang, Xinyi
Wang, Kewei
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Wang, Kewei
Wang, Fang
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Wang, Fang
Li, Jiangjiang
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Li, Jiangjiang
Wu, Zhicheng
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Chinese Acad Sci, Inst Microelect, State Key Lab Fabricat Technol Integrated Circuit, Beijing 100029, Peoples R China
Chinese Acad Sci, Inst Microelect, Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Wu, Zhicheng
Li, Duoli
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Li, Duoli
Li, Bo
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Li, Bo
Bu, Jianhui
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Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Bu, Jianhui
Han, Zhengsheng
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机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R China
Chinese Acad Sci, Key Lab Sci & Technol Silicon Devices, Beijing 100029, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Han, Zhengsheng
2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS,
2023,