Reliability of ultra thin gate oxide CMOS devices: Design perspective

被引:0
|
作者
Parthasarathy, C. R. [1 ,3 ]
Denais, M. [1 ]
Huard, V. [2 ]
Ribes, G. [1 ]
Vincent, E. [1 ]
Bravaix, A. [3 ]
机构
[1] STMicroelect, 850,Rue Jean Monet, F-38926 Crolles, France
[2] Philips Semicond, F-38926 Crolles, France
[3] UMR CNRS 6137, Maison Technol, L2MP ISEN, F-83000 Toulon, France
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Assessment of design implications due to degradation of CMOS devices is increasingly required in the latest technologies. This paper discusses degradation due to channel hot carriers, NBTI and oxide breakdown from a design perspective-in terms of characterization, mechanisms and circuit analysis-introducing assessment of multiple degradation modes on same device.
引用
收藏
页码:122 / +
页数:3
相关论文
共 50 条
  • [41] Gate Oxide Reliability Improvement for CMOS and MEMS Monolithic Integration
    Tsai, L. Y.
    Yeh, P. C.
    Leu, L-Y.
    Kuo, X. X.
    Shih, J. R.
    Lee, Y-H.
    Wu, K.
    Tai, W. C.
    Hung, C. M.
    Yang, C. Y.
    Chen, S. F.
    2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2012,
  • [42] Gate leakage current of NMOSFET with ultra-thin gate oxide
    Shi-gang Hu
    Xiao-Feng Wu
    Zai-fang Xi
    Journal of Central South University, 2012, 19 : 3105 - 3109
  • [43] Gate leakage current of NMOSFET with ultra-thin gate oxide
    胡仕刚
    吴笑峰
    席在芳
    Journal of Central South University, 2012, 19 (11) : 3105 - 3109
  • [44] Gate leakage current of NMOSFET with ultra-thin gate oxide
    Hu Shi-gang
    Wu Xiao-feng
    Xi Zai-fang
    JOURNAL OF CENTRAL SOUTH UNIVERSITY, 2012, 19 (11) : 3105 - 3109
  • [45] Power-law voltage acceleration:: A key element for ultra-thin gate oxide reliability
    Wu, EY
    Suñé, J
    MICROELECTRONICS RELIABILITY, 2005, 45 (12) : 1809 - 1834
  • [46] ESD induced damage on ultra-thin gate oxide mosfets and its impact on device reliability
    Cester, A
    Gerardin, S
    Tazzoli, A
    Paccagnella, A
    Zanom, E
    Ghidini, G
    Meneghesso, G
    2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 84 - 90
  • [47] Effect of deuterium anneal on thin gate oxide reliability
    Cellere, G
    Paccagnella, A
    Valentini, MG
    Alessandri, M
    2005 INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, 2005, : 139 - 142
  • [48] Modeling and analysis of gate leakage in ultra-thin oxide sub-50nm double gate devices and circuits
    Mukhopadhyay, S
    Kim, K
    Kim, JJ
    Lo, SH
    Joshi, RV
    Chuang, CT
    Roy, K
    6TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, PROCEEDINGS, 2005, : 410 - 415
  • [49] Ultra-thin gate oxide lifetime projection and degradation mechanism beyond 90 nm CMOS technology
    Lin, Cheng-Li
    Kao, Tom
    Chen, Ju-Ping
    Yang, Jeff Y. C.
    Su, K. C.
    2006 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP, FINAL REPORT, 2006, : 186 - +
  • [50] Impact of device scaling on the 1/f noise performance of deep submicrometer thin gate oxide CMOS devices
    Chew, Kok Wai
    Yeo, Kiat Seng
    Chu, Shao-Fu Sanford
    Cheng, Michael
    SOLID-STATE ELECTRONICS, 2006, 50 (7-8) : 1219 - 1226