Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

被引:18
|
作者
Xian, J. W. [1 ]
Belyakov, S. A. [1 ]
Gourlay, C. M. [1 ]
机构
[1] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2AZ, England
基金
英国工程与自然科学研究理事会;
关键词
Pb-free soldering; grain refinement; intermetallics; crystal growth; orientation relationship (OR); heterogeneous nucleation; SN-CU; SOLDER ALLOYS; PHASE; ETA-CU6SN5; ADDITIONS; GROWTH;
D O I
10.1007/s11664-015-4092-y
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm(2) is 7 times higher and the mean three-dimensional length of rods is 4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on delta-Cu33Al17 or gamma (1)-Cu9Al4 particles, which are stablea in pound the Sn-0.7Cu-0.05Al melt during holding at 250A degrees C. The observed facet relationships agree well with previously determined orientation relationships between delta-Cu33Al17 and Cu6Sn5 in hypereutectic Sn-Cu-Al alloys and result in a good lattice match with < 2.5% lattice mismatch on two different interfacial planes.
引用
收藏
页码:69 / 78
页数:10
相关论文
共 50 条
  • [21] Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films
    Bykova, L. E.
    Zharkov, S. M.
    Myagkov, V. G.
    Balashov, Yu. Yu.
    Patrin, G. S.
    PHYSICS OF THE SOLID STATE, 2022, 64 (02) : 33 - 37
  • [22] Growth Behavior of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu(0.1RE) Solder Joints for Micro-Joining
    Wang Yaoli
    Zhang Keke
    Liu Shuai
    Zhao Guoji
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 (01) : 117 - 121
  • [23] The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints
    Z. Q. Li
    S. A. Belyakov
    J. W. Xian
    C. M. Gourlay
    Journal of Electronic Materials, 2018, 47 : 84 - 95
  • [24] Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5
    Mu, Dekui
    Read, Jonathan
    Yang, Yafeng
    Nogita, Kazuhiro
    JOURNAL OF MATERIALS RESEARCH, 2011, 26 (20) : 2660 - 2664
  • [25] Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films
    L. E. Bykova
    S. M. Zharkov
    V. G. Myagkov
    Yu. Yu. Balashov
    G. S. Patrin
    Physics of the Solid State, 2022, 64 : 33 - 37
  • [26] The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints
    Li, Z. Q.
    Belyakov, S. A.
    Xian, J. W.
    Gourlay, C. M.
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (01) : 84 - 95
  • [27] Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5
    Dekui Mu
    Jonathan Read
    Yafeng Yang
    Kazuhiro Nogita
    Journal of Materials Research, 2011, 26 : 2660 - 2664
  • [28] Heterogeneous nucleation of Cu6Sn5in Sn-Cu-Al solders
    Xian, J.W.
    Belyakov, S.A.
    Britton, T.B.
    Gourlay, C.M.
    Journal of Alloys and Compounds, 2016, 619 : 345 - 355
  • [29] Formation of interfacial η′-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging (vol 27, pg 1468, 2011)
    Luo, Zhongbing
    Wang, Lai
    Fu, Qinqin
    Cheng, Chongqian
    Zhao, Jie
    JOURNAL OF MATERIALS RESEARCH, 2011, 26 (14) : 1742 - 1742
  • [30] Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient
    Qiao, Yuanyuan
    Liang, Hongwei
    Zhao, Ning
    JOURNAL OF MATERIALS SCIENCE, 2023, 58 (11) : 5010 - 5022