Growth Behavior of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu(0.1RE) Solder Joints for Micro-Joining

被引：0
|
作者：
Wang Yaoli [1 ,2 ]
Zhang Keke [2 ]
Liu Shuai
Zhao Guoji
机构：
[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Luoyang 471003, Peoples R China
[2] Nonferrous Mat Sci & Proc Tech Key Lab Henan Prov, Luoyang 471000, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2010年 / 39卷 / 01期
关键词：
Sn-2.5Ag-0.7Cu(0.1 RE) solder; soldering; aging; Cu6Sn5; growth dynamics; CU;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The microstructure of low-Ag-content Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface and growth behavior of Cu6Sn5 intermetallic compound (IMC) were investigated by XRD, SEM and EDAX. The results show that the Cu6Sn5 thickness of the solder joint interface is decided by its dissolution and growing during soldering. With the aging time increasing, the Cu6Sn5 morphology of the solder joint interface changed from scallop-like to lamellar; the growth dynamics follows the parabola law and its growth behavior is controlled by diffusion mechanism. Addition of 0.1% RE (mass fraction) in the Sn-2.5Ag-0.7Cu solder alloy can effectively reduce the growing rate of the solder joint Cu6Sn5 IMC during the soldering and aging period, and change the fracture mechanism of solder joint; therefore the reliability of the solder joint can be greatly improved.
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页码：117 / 121
页数：5
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