2D and 3D heterogeneous photonic integrated circuits

被引：2
|
作者：
Ben Yoo, S. J. [1 ]
机构：
[1] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
来源：
SMART PHOTONIC AND OPTOELECTRONIC INTEGRATED CIRCUITS XVI | 2014年 / 8989卷
关键词：
3D integration; photonic integration; laser inscription; ULTRAFAST-LASER INSCRIPTION; LOSS WAVE-GUIDES; FEMTOSECOND LASER; INTERCONNECTION;
D O I：
10.1117/12.2047502
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances in photonic integration demands an addition of a new dimension in integration. 3D integration emerges as a new necessity in providing functional integrated microsystems for modern computing, networking, and imaging applications.
引用
收藏
页数：9
相关论文
共 50 条
  • [21] Scalable 3D Silicon Photonic Electronic Integrated Circuits and Their Applications
    Zhang, Yu
    Samanta, Anirban
    Shang, Kuanping
    Yoo, S. J. Ben
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2020, 26 (02)
  • [22] Fabrication of 3D photonic crystal from 2D photonic plates by micromanipulation
    Aoki, K
    Miyazaki, HT
    Hirayama, H
    Inoshita, K
    Baba, T
    Shinya, N
    Aoyagi, Y
    CLEO(R)/PACIFIC RIM 2001, VOL I, TECHNICAL DIGEST, 2001, : 14 - 15
  • [23] 2D dichalcogenides promise efficient electronic-photonic integrated circuits
    Overton, Gail
    LASER FOCUS WORLD, 2016, 52 (08): : 14 - 15
  • [24] Integrated 2D and 3D images for face recognition
    Wang, YJ
    Chua, CS
    Ho, YK
    Ren, Y
    11TH INTERNATIONAL CONFERENCE ON IMAGE ANALYSIS AND PROCESSING, PROCEEDINGS, 2001, : 48 - 53
  • [25] CONSTRUCTING 2D AND 3D CLUSTER STATES WITH PHOTONIC MODULES
    Ionicioiu, Radu
    Munro, William J.
    INTERNATIONAL JOURNAL OF QUANTUM INFORMATION, 2010, 8 (1-2) : 149 - 159
  • [26] An Overview of 3D Integrated Circuits
    Kumar, Vachan
    Naeemi, Azad
    2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO), 2017, : 311 - 313
  • [27] Monolithic 3D integrated circuits
    Wong, Simon
    El-Gamal, Abbas
    Griffin, Peter
    Nishi, Yoshio
    Pease, Fabian
    Plummer, James
    2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 66 - +
  • [28] Advances in 3D Integrated Circuits
    Patti, Robert
    ISPD 11: PROCEEDINGS OF THE 2011 ACM/SIGDA INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2011, : 79 - 79
  • [29] Multilayer Silicon Nitride-on-Silicon Integrated Photonic Platform for 3D Photonic Circuits
    Sacher, Wesley D.
    Yong, Zheng
    Mikkelsen, Jared C.
    Bois, Antoine
    Yang, Yisu
    Mak, Jason C. C.
    Dumais, Patrick
    Goodwill, Dominic
    Ma, Chaoxuan
    Jeong, Junho
    Bernier, Eric
    Poon, Joyce K. S.
    2016 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2016,
  • [30] 3D silicon photonic interconnects and integrated circuits based on phase matching
    Bian, Yusheng
    Jacob, Ajey
    Rakowski, Michal
    Sporer, Ryan
    Hirokawa, Takako
    Lee, Won Suk
    Chowdhury, Asif
    Thomas, Abu
    Peng, Bo
    Aboketaf, Abdelsalam
    Ayala, Javier
    Augur, Rod
    Giewont, Ken
    Pellerin, John
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 2279 - 2284
12345