An Overview of 3D Integrated Circuits

被引：0

作者：

Kumar, Vachan ^{[1
]}

Naeemi, Azad ^{[2
]}

机构：

[1] Intel Corp, Lib Technol Benchmarking, Hillsboro, OR 97124 USA

[2] Georgia Inst Technol, Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO) | 2017年

关键词：

3D Integration; Through Silicon Via (TSV); interconnect; Via-first; Via-middle; Via-last; interposer; heat removal; IC test;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An overview of three-dimensional integrated circuits (3D ICs) is presented in this paper. The key potential applications of 3D ICs that have the most impact in terms of performance, power and area are highlighted, followed by a brief overview of the different technology approaches to implement 3D ICs. Further, the key challenges to 3D integration are discussed here.

引用

页码：311 / 313

页数：3

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