The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints

被引：2
|
作者：
Shen, Jun [1 ]
He, Peipei [1 ]
Zhang, Tao [1 ]
Li, Yang [1 ]
Pu, Yayun [1 ]
Chen, Jie [1 ]
机构：
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2014年 / 25卷 / 11期
基金：
中国国家自然科学基金;
关键词：
LEAD-FREE SOLDERS; AG-CU SOLDERS; COMPOSITE SOLDERS; CREEP-PROPERTIES; ALLOY; NANOPARTICLES; MICROHARDNESS; RELIABILITY;
D O I：
10.1007/s10854-014-2233-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the effects of Mn powder on fusion property of Sn3.0Ag0.5Cu solder alloy and microstructures as well as tensile property of the solder joints of Sn3.0Ag0.5Cu/Cu were investigated by differential scanning calorimetry analysis, scanning electron microscopy and tensile tests. The results showed that the addition of Mn dramatically suppressed under cooling of SnAgCu solder alloy. Mn addition contributed to the growth of Cu6Sn5 intermetallic compound layers since it provided nucleation sites for Cu6Sn5 at the solder joints. Moreover, Mn addition increased the hardness of the solder alloys and reduced the tensile strength of SnAgCu/Cu solder joints. During aging, the growth of IMC layers of SnAgCuMn/Cu solder joints was slower than that of SnAgCu/Cu solder joints, and the tensile strength of all the solder joints increased after aging.
引用
收藏
页码：4779 / 4785
页数：7
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