High-Temperature Thermal–Electrical Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints

被引：0
|
作者：
C. W. An
Q. K. Zhang
Z. L. Song
机构：
[1] Chinese Academy of Sciences,Ningbo Institute of Materials Technology and Engineering
[2] Kunming University of Science and Technology,Faculty of Material Science and Engineering
来源：
Journal of Electronic Materials | 2023年 / 52卷
关键词：
Solder joints; coupling damage; local melting; electromigration; plastic deformation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：3807 / 3817
页数：10
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