The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints

被引：2
|
作者：
Shen, Jun [1 ]
He, Peipei [1 ]
Zhang, Tao [1 ]
Li, Yang [1 ]
Pu, Yayun [1 ]
Chen, Jie [1 ]
机构：
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2014年 / 25卷 / 11期
基金：
中国国家自然科学基金;
关键词：
LEAD-FREE SOLDERS; AG-CU SOLDERS; COMPOSITE SOLDERS; CREEP-PROPERTIES; ALLOY; NANOPARTICLES; MICROHARDNESS; RELIABILITY;
D O I：
10.1007/s10854-014-2233-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the effects of Mn powder on fusion property of Sn3.0Ag0.5Cu solder alloy and microstructures as well as tensile property of the solder joints of Sn3.0Ag0.5Cu/Cu were investigated by differential scanning calorimetry analysis, scanning electron microscopy and tensile tests. The results showed that the addition of Mn dramatically suppressed under cooling of SnAgCu solder alloy. Mn addition contributed to the growth of Cu6Sn5 intermetallic compound layers since it provided nucleation sites for Cu6Sn5 at the solder joints. Moreover, Mn addition increased the hardness of the solder alloys and reduced the tensile strength of SnAgCu/Cu solder joints. During aging, the growth of IMC layers of SnAgCuMn/Cu solder joints was slower than that of SnAgCu/Cu solder joints, and the tensile strength of all the solder joints increased after aging.
引用
收藏
页码：4779 / 4785
页数：7
相关论文
共 50 条
  • [21] Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints
    Cuiping Wu
    Jun Shen
    Changfei Peng
    Journal of Materials Science: Materials in Electronics, 2012, 23 : 14 - 21
  • [22] Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints
    Wu, Cuiping
    Shen, Jun
    Peng, Changfei
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (01) : 14 - 21
  • [23] Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices
    Liang Zhang
    Xi-ying Fan
    Yong-huan Guo
    Cheng-wen He
    Electronic Materials Letters, 2014, 10 : 645 - 647
  • [24] Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices
    Zhang, Liang
    Fan, Xi-ying
    Guo, Yong-huan
    He, Cheng-wen
    ELECTRONIC MATERIALS LETTERS, 2014, 10 (03) : 645 - 647
  • [25] TENSILE BEHAVIOR OF PB-SN SOLDER CU JOINTS
    QUAN, L
    FREAR, D
    GRIVAS, D
    MORRIS, JW
    JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (03) : 203 - 208
  • [26] TENSILE BEHAVIOR OF PB-SN/CU SOLDER JOINTS
    QUAN, L
    FREAR, D
    KIM, J
    MORRIS, JW
    JOURNAL OF METALS, 1985, 37 (11): : A53 - A53
  • [27] Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints
    Seo, Young-Jin
    Yoon, Jeong-Won
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (20) : 16700 - 16709
  • [28] Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints
    Young-Jin Seo
    Jeong-Won Yoon
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 16700 - 16709
  • [29] The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
    Liu, Weiping
    Lee, Ning-Cheng
    JOM, 2007, 59 (07) : 26 - 31
  • [30] The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
    Weiping Liu
    Ning-Cheng Lee
    JOM, 2007, 59 : 26 - 31
12345