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- [41] High-performance flip-chip BGA technology based on thin-core and coreless package substrate J. Jpn. Inst. Electron. Packag., 2008, 3 (212-216):
- [42] High-performance flip-chip BGA technology based on thin-core and coreless package substrate 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1869 - +
- [43] Novel 190V LIGBT-based ESD protection for 0.35μm Smart Power technology realized on SOI substrate ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS - 2008, 2008, : 211 - +
- [45] Measuring Supply Chain Performance as SCOR v13.0-Based in Disruptive Technology Era: Scale Development and Validation LOGISTICS-BASEL, 2023, 7 (03):
- [47] Wide-Bandwidth V-Band Circularly Polarized IPD Based Quarter-Mode Substrate-Integrated Waveguide Antenna Using Flip Chip Technology 2020 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND NORTH AMERICAN RADIO SCIENCE MEETING, 2020, : 1601 - 1602
- [48] Coating Ti6Al4V substrate with the triple-layer glass-ceramic compositions using sol–gel method; the critical effect of the composition of the layers on the mechanical and in vitro biological performance Journal of Sol-Gel Science and Technology, 2020, 94 : 743 - 753
- [50] High performance of 0.15μm quasi enhancement-mode (E-mode) In0.4GaAs/In0.4AlAs metamorphic HEMT's on GaAs substrate using new triple-gate technology 2004 International Conference on Indium Phosphide and Related Materials, Conference Proceedings, 2004, : 374 - 377