High-performance flip-chip BGA technology based on thin-core and coreless package substrate

被引：0
|
作者：
Fujitsu Limited, Kawasaki 211-8588, Japan [1 ]
不详 [2 ]
机构：
来源：
J. Jpn. Inst. Electron. Packag. | 2008年 / 3卷 / 212-216期
关键词：
2;
D O I：
10.5104/jiep.11.212
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] High-performance flip-chip BGA technology based on thin-core and coreless package substrate
    Koide, Masateru
    Fukuzono, Kenji
    Yoshimura, Hideaki
    Sato, Toshihisa
    Abe, Kenichiro
    Fujisaki, Hidehiko
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1869 - +
  • [2] High performance coreless flip-chip BGA packaging technology
    Chang, David
    Wang, Y. P.
    Hsiao, C. S.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1765 - +
  • [3] Study of package warp behavior for high-performance flip-chip BGA
    Sawada, Y
    Harada, K
    Fujioka, H
    MICROELECTRONICS RELIABILITY, 2003, 43 (03) : 465 - 471
  • [4] Development of thin flip-chip BGA for package on package
    Suzuki, Yasuhiro
    Kayashima, Yuuji
    Maeda, Takehik
    Matsuura, Yoshihiro
    Sekiguchi, Tomobisa
    Watanabe, Akio
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 8 - +
  • [5] Advanced Coreless Flip-chip BGA Package with High Dielectric Constant Thin Film Embedded Decoupling Capacitor
    Kim, GaWon
    Lee, SeungJae
    Yu, JiHeon
    Jung, GyuIck
    Kim, JinYoung
    Karim, Nozard
    Yoo, HeeYeoul
    Lee, ChoonHeung
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 595 - 600
  • [6] High-performance flip-chip BGA based on multi-layer thin-film packaging technology
    Shimoto, T
    Kikuchi, K
    Honda, H
    Kata, K
    Baba, K
    Matsui, K
    2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 10 - 15
  • [7] Study of underfill resin properties for high performance flip-chip BGA package
    Sawada, Y
    Harada, K
    Fujioka, H
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 588 - 593
  • [8] Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
    Chong, DYR
    Kapoor, R
    Sun, AYS
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 207 - 213
  • [9] Design and Electrical Performance Analysis on Coreless Flip Chip BGA Substrate
    Huang, Chih-Yi
    Wang, Chen-Chao
    Hsieh, Tsun-Lung
    Tsai, Cheng-Yu
    2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2017,
  • [10] Evaluation and Verification of Enhanced Electrical Performance of Advanced Coreless Flip-chip BGA Package with Warpage Measurement Data
    Kim, GaWon
    Yu, JiHeon
    Park, ChulWoo
    Hong, SeoungJoon
    Kim, JinYoung
    Rinne, Glenn
    Lee, ChoonHeung
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 897 - 903
12345