On the Progressive Performance of a 700-V Triple RESURF LDMOS Based on Substrate Termination Technology

被引:0
|
作者
Qiao, Ming [1 ]
Yu, Liang-Liang [1 ]
Wang, Hui-Hui [2 ]
Jin, Feng [2 ]
Li, Zhao-Ji [1 ]
Zhang, Bo [1 ]
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu, Sichuan, Peoples R China
[2] Shanghai Huahong Grace Semicond Mfg Corp, Shanghai, Peoples R China
基金
中国国家自然科学基金;
关键词
DMOS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a novel triple reduced surface field (RESURF) LDMOS with N-top layer based on substrate termination technology (STT) is proposed. The analytical models of surface potential, surface electric field, breakdown voltage (BV) and optimal integrated charge of N-top layer (Q(ntop)) for the novel triple RESURF LDMOS are achieved. Furthermore, STT is applied to avoid the premature avalanche breakdown occurring in the curved source region with small curvature radius for the interdigitated layout. Two key parameters of L and L-P are optimized. With optimization for the termination region, the LDMOS demonstrates a progressive performance with lowest specific on-resistance (R-on,R-sp) for the 700-V LDMOS in comparison to the other latest existing technologies.
引用
收藏
页码:385 / 388
页数:4
相关论文
共 50 条
  • [21] Design and Analysis of a Double RESURF 700V LIGBT with quasi-vertical DMOSFET in Junction Isolation Technology
    Tsai, Ying-Chieh
    Gong, Jeng
    Chan, W. C.
    Wu, S. Y.
    Lien, C. H.
    2014 IEEE 26TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & IC'S (ISPSD), 2014, : 147 - 150
  • [22] A 0.25 μm 700 V BCD Technology with Ultra-low Specific On-resistance SJ-LDMOS
    He, Nailong
    Zhang, Sen
    Zhu, Xuhan
    Li, Xuchao
    Wang, Hao
    Zhang, Wentong
    He, Boyong
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 419 - 422
  • [23] A performance comparison between new reduced surface drain ''RSD'' LDMOS and RESURF and conventional planar power devices rated at 20V
    Efland, T
    Tsai, CY
    Erdeljac, J
    Mitros, J
    Hutter, L
    ISPSD '97: 1997 IEEE INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS, 1997, : 185 - 188
  • [24] High Performance Pch-LDMOS Transistors in Wide Range Voltage from 35V to 200V SOI LDMOS Platform Technology
    Shimamoto, Satoshi
    Yanagida, Yohei
    Shirakawa, Shinji
    Miyakoshi, Kenji
    Imai, Toshinori
    Oshima, Takayuki
    Sakano, Junichi
    Wada, Shinichiro
    2011 IEEE 23RD INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2011, : 44 - 47
  • [25] Complementary 25V LDMOS for analog applications based on 0.6 μm BiCMOS technology
    Nakamura, K
    Kawaguchi, Y
    Karouji, K
    Watanabe, K
    Yamaguchi, Y
    Nakagawa, A
    PROCEEDINGS OF THE 2000 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2000, : 94 - 97
  • [26] Design of 700V LIGBT with the suppressed Substrate Current in a 0.5um Junction Isolated Technology
    Su, R. Y.
    Cheng, C. C.
    Huo, K. H.
    Yang, F. J.
    Tsai, J. L.
    Liou, R. S.
    Tuan, H. C.
    2012 24TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2012, : 221 - 224
  • [27] Suppression of Hot-Hole Injection in High-Voltage Triple RESURF LDMOS With Sandwich N-P-N Layer: Toward High-Performance and High-Reliability
    Qiao, Ming
    Yuan, Zhangyi'an
    Li, Yi
    Zhou, Xin
    Jin, Feng
    Yang, Jiye
    Cai, Ying
    Li, Zhaoji
    Zhang, Bo
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 415 - 418
  • [28] 16-60V rated LDMOS show advanced performance in an 0.72μm evolution BiCMOS power technology
    Tsai, CY
    Efland, T
    Pendharkar, S
    Mitros, J
    Tessmer, A
    Smith, J
    Erdeljac, J
    Hutter, L
    INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 367 - 370
  • [29] Study on Single Event Burnout Effect for 18V LDMOS Based on 0.18μm Process Technology
    Chen, Langtao
    Zhou, Xin
    Wang, Ying
    Kong, Ying
    Xie, Rubin
    Peng, Ling
    Mo, Yantu
    Qiao, Ming
    Zhang, Bo
    2022 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS, APCCAS, 2022, : 588 - 591
  • [30] The Court of Appeal's Look North for a Solution Goes South: Liquidated Damages and Termination in Triple Point Technology v PTT
    Davie, Michael Q. C.
    Dowers, Neil
    EDINBURGH LAW REVIEW, 2019, 23 (03) : 395 - 401