共 50 条
- [31] Analysis inductively coupling wireless connection in 3D package [J]. 2013 IEEE 10TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2013,
- [32] 3D Heterogeneous System Integration: Application Driver for 3D Technology Development [J]. PROCEEDINGS OF THE 48TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2011, : 213 - 213
- [33] 3D Advanced Integration Technology for Heterogeneous Systems [J]. 2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
- [34] 3D Stacking Heterogeneous Integration for Devices and Modules [J]. CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 721 - 726
- [35] Heterogeneous Integration toward Monolithic 3D Chip [J]. 2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2017,
- [36] Security Advantages and Challenges of 3D Heterogeneous Integration [J]. COMPUTER, 2024, 57 (03) : 107 - 112
- [37] Technologies for 3D Wafer Level Heterogeneous Integration [J]. DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 123 - +
- [38] Opportunities for 2.5/3D Heterogeneous SoC Integration [J]. 2021 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2021,
- [39] 3D Heterogeneous Integration Technology for AI System [J]. 2020 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2020,
- [40] A Modularized 3D Heterogeneous System Integration Platform [J]. 2012 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS), 2012, : 396 - 399