Heterogeneous Integration toward Monolithic 3D Chip

被引：0
|
作者：
Kim, SangHyeon [1 ]
Kim, Seong-Kwang [1 ]
Shim, Jae-Phil [1 ]
Geum, Dae-myeong [1 ]
Ju, Gunwu [1 ]
Kim, Han Sung [1 ]
Lim, Hee Jung [1 ]
Lim, Hyeong Rak [1 ]
Han, Jae-Hoon [1 ]
Kang, ChangMo [2 ]
Lee, Dong Seon [2 ]
Song, Jin Dong [1 ]
Choi, Won Jun [1 ]
Kim, Hyung-jun [1 ]
机构：
[1] Korea Inst Sci & Technol, Seoul, South Korea
[2] Gwangju Inst Sci & Technol, Gwangju, South Korea
来源：
2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2017年
基金：
新加坡国家研究基金会;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：2
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