Heterogeneous Integration toward Monolithic 3D Chip

被引：0

作者：

Kim, SangHyeon ^{[1
]}

Kim, Seong-Kwang ^{[1
]}

Shim, Jae-Phil ^{[1
]}

Geum, Dae-myeong ^{[1
]}

Ju, Gunwu ^{[1
]}

Kim, Han Sung ^{[1
]}

Lim, Hee Jung ^{[1
]}

Lim, Hyeong Rak ^{[1
]}

Han, Jae-Hoon ^{[1
]}

Kang, ChangMo ^{[2
]}

Lee, Dong Seon ^{[2
]}

Song, Jin Dong ^{[1
]}

Choi, Won Jun ^{[1
]}

Kim, Hyung-jun ^{[1
]}

机构：

[1] Korea Inst Sci & Technol, Seoul, South Korea

[2] Gwangju Inst Sci & Technol, Gwangju, South Korea

来源：

2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2017年

基金：

新加坡国家研究基金会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页数：2

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