Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs

被引:36
|
作者
Gomez, Leonardo [1 ,2 ]
Hashemi, Pouya [1 ,2 ]
Hoyt, Judy L. [1 ,2 ]
机构
[1] MIT, Microsyst Technol Labs, Cambridge, MA 02139 USA
[2] MIT, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA
关键词
Hole mobility; hole velocity; p-MOSFET; silicon germanium; uniaxial stress; MOBILITY; GE; LENGTH;
D O I
10.1109/TED.2009.2031043
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hole mobility and velocity are extracted from scaled strained-Si0.45Ge0.55 channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained-Si0.45Ge0.55 channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of < 110 > uniaxial compressive strain to Si0.45Ge0.55 can result in a more substantial increase in velocity relative to relaxed Si.
引用
收藏
页码:2644 / 2651
页数:8
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