Intermetallic phase transformations in Au-Al wire bonds

被引:45
|
作者
Xu, H. [1 ]
Liu, C. [2 ]
Silberschmidt, V. V. [2 ]
Pramana, S. S. [3 ]
White, T. J. [3 ,4 ]
Chen, Z. [3 ]
Acoff, V. L. [1 ]
机构
[1] Univ Alabama, Dept Met & Mat Engn, Tuscaloosa, AL 35487 USA
[2] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England
[3] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore
[4] Australian Natl Univ, Ctr Adv Microscopy, Canberra, ACT 2601, Australia
关键词
Aluminides; Phase transformation; Wire bonding; Microstructure; Electron microscopy; GOLD BALL BONDS; COMPOUND FORMATION; CRYSTAL-STRUCTURE; ALUMINUM; COPPER; GROWTH; DEGRADATION; COUPLES; VOIDS; FILMS;
D O I
10.1016/j.intermet.2011.07.003
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper describes the crystallochemical mechanisms that underpin the migration of nano-size alumina, intermetallic growth and phase transformations in Au-Al wire bonds during annealing from 175 degrees C to 250 degrees C by utilizing high-resolution transmission electron microscopy (HRTEM). Alumina, encapsulated within the Au-Al intermetallic compounds (IMCs), migrates towards the Au ball during annealing, with Au diffusion into the Al pad. The sequence of Au-Al IMC phase development during annealing was investigated. Initially. Au(8)Al(3) appears as a third phase between the Au(4)Al and AuAl(2) layers that form during bonding, and gradually becomes the dominant compound. Both AuAl(2) and Au(8)Al(3) are transformed into the Au-rich alloyAu(4)Al when Al is completely consumed, and this is the terminal product. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1808 / 1816
页数:9
相关论文
共 50 条
  • [41] Observations of IMC Formation for Au Wire Bonds to Al Pads
    John DeLucca
    John Osenbach
    Frank Baiocchi
    Journal of Electronic Materials, 2012, 41 : 748 - 756
  • [42] Observations of IMC Formation for Au Wire Bonds to Al Pads
    DeLucca, John
    Osenbach, John
    Baiocchi, Frank
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (04) : 748 - 756
  • [43] Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance
    Wang Bisheng
    Jinzhi, Lois Liao
    Zhang Xi
    Li Xiaomin
    Hua Younan
    Weikok, Tee
    Boonhwa, Yee
    Mao Songlin
    Yao Qinghong
    2019 IEEE 26TH INTERNATIONAL SYMPOSIUM ON PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2019,
  • [44] Partial diffusion reactions and the associated volume changes in thermally exposed Au-Al ball bonds
    Noolu, NJ
    Murdeshwar, NM
    Ely, KJ
    Lippold, JC
    Baeslack, WA
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2004, 35A (04): : 1273 - 1280
  • [45] Characterization of the interdiffusion in Au-Al layers by RBS
    Markwitz, A
    Vandesteene, N
    Waldschmidt, M
    Demortier, G
    FRESENIUS JOURNAL OF ANALYTICAL CHEMISTRY, 1997, 358 (1-2): : 59 - 63
  • [46] AU-AL COMPOUND FORMATION - IMPURITY EFFECTS
    MAJNI, G
    DELPENNINO, U
    QUEIROLO, G
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) : C346 - C346
  • [47] Mechanistic Study of Alkyne Insertion into Cu-Al and Au-Al Bonds: A Paradigm Shift for Coinage Metal Chemistry
    Sorbelli, Diego
    Belpassi, Leonardo
    Belanzoni, Paola
    INORGANIC CHEMISTRY, 2022, 61 (51) : 21095 - 21106
  • [48] Characterization of the interdiffusion in Au-Al layers by RBS
    A. Markwitz
    N. Vandesteene
    M. Waldschmidt
    G. Demortier
    Fresenius' Journal of Analytical Chemistry, 1997, 358 : 59 - 63
  • [49] Insight on the Electronic, Elastic and Thermal Properties of Au-Al Intermetallic Compounds Based on First-Principles Calculations
    Lu, Jinkang
    Zhan, Mingyi
    Yu, Jie
    Yu, Xue
    Duan, Yonghua
    Chen, Song
    Xu, Mingli
    Lu, Wenting
    JOURNAL OF ELECTRONIC MATERIALS, 2024, 53 (07) : 3809 - 3821
  • [50] FORMATION OF AL-AU INTERMETALLIC COMPOUNDS AND RESISTANCE INCREASE FOR ULTRASONIC AL WIRE BONDING
    KASHIWABARA, M
    HATTORI, S
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1969, 17 (09): : 1001 - +