共 50 条
- [32] A thermal aging study on both Au-Cu and Au-Al wire-bonded interlaces 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1761 - 1766
- [33] Ultrasonic bonding: Understanding how process parameters determine the strength of au-al bonds 2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 626 - 631
- [37] Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2023, 59 (22): : 322 - 331
- [38] Thermodynamic description of the Au-Al system ZEITSCHRIFT FUR METALLKUNDE, 2004, 95 (01): : 45 - 49
- [40] Partial diffusion reactions and the associated volume changes in thermally exposed Au-Al ball bonds Metallurgical and Materials Transactions A, 2004, 35 : 1273 - 1280