Intermetallic phase transformations in Au-Al wire bonds

被引:45
|
作者
Xu, H. [1 ]
Liu, C. [2 ]
Silberschmidt, V. V. [2 ]
Pramana, S. S. [3 ]
White, T. J. [3 ,4 ]
Chen, Z. [3 ]
Acoff, V. L. [1 ]
机构
[1] Univ Alabama, Dept Met & Mat Engn, Tuscaloosa, AL 35487 USA
[2] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England
[3] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore
[4] Australian Natl Univ, Ctr Adv Microscopy, Canberra, ACT 2601, Australia
关键词
Aluminides; Phase transformation; Wire bonding; Microstructure; Electron microscopy; GOLD BALL BONDS; COMPOUND FORMATION; CRYSTAL-STRUCTURE; ALUMINUM; COPPER; GROWTH; DEGRADATION; COUPLES; VOIDS; FILMS;
D O I
10.1016/j.intermet.2011.07.003
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper describes the crystallochemical mechanisms that underpin the migration of nano-size alumina, intermetallic growth and phase transformations in Au-Al wire bonds during annealing from 175 degrees C to 250 degrees C by utilizing high-resolution transmission electron microscopy (HRTEM). Alumina, encapsulated within the Au-Al intermetallic compounds (IMCs), migrates towards the Au ball during annealing, with Au diffusion into the Al pad. The sequence of Au-Al IMC phase development during annealing was investigated. Initially. Au(8)Al(3) appears as a third phase between the Au(4)Al and AuAl(2) layers that form during bonding, and gradually becomes the dominant compound. Both AuAl(2) and Au(8)Al(3) are transformed into the Au-rich alloyAu(4)Al when Al is completely consumed, and this is the terminal product. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1808 / 1816
页数:9
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