Ultra-Short-Reach Interconnects for Package-Level Integration

被引：0
|
作者：
Carusone, Anthony Chan [1 ]
Dehlaghi, Behzad [1 ]
Beerkens, Rudy [2 ]
Tonietto, Davide [2 ]
机构：
[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 1A1, Canada
[2] Huawei Canada Res Ctr, HiSilicon Div, Ottawa, ON, Canada
来源：
2016 IEEE OPTICAL INTERCONNECTS CONFERENCE (OI) | 2016年
关键词：
CMOS TECHNOLOGY; 32; NM;
D O I：
暂无
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
Package-level integration of disparate technologies on either silicon interposers or organic packaging substrates is a key enabler for future optical subsystems. High-performance computing and networking applications will require tremendous interconnection bandwidth between co-packaged dies. To make package-level integration seamless, transceivers for these ultra-short-reach links must fit within vanishingly small area and power footprints.
引用
收藏
页码：10 / 11
页数：2
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