Empirical correlation between package-level ball impact test and board-level drop reliability

被引：32
|
作者：
Yeh, Chang-Lin [1 ]
Lai, Yi-Shao [1 ]
Chang, Hsiao-Chuan [1 ]
Chen, Tsan-Hsien [1 ]
机构：
[1] Adv Semicond Engn Inc, Stress Reliabil Lab, Kaohsiung 811, Taiwan
来源：
MICROELECTRONICS RELIABILITY | 2007年 / 47卷 / 07期
关键词：
D O I：
10.1016/j.microrel.2006.07.093
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Package-level ball impact test and board-level drop test are performed and correlated using a specific chip-scale package with solder joints of different Sn-Ag-Cu solder compositions. A positive correlation is found between characteristics of the impact force profile and reliability from the drop test, which provides a supporting basis for the package-level ball impact test to serve as a substitute of the timely and costly board-level drop test. (C) 2006 Published by Elsevier Ltd.
引用
收藏
页码：1127 / 1134
页数：8
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