Advances in magnetic microscopy for stacked-die and package-level fault isolation

被引：0
|
作者：
Gaudestad, JO [1 ]
Woods, SI [1 ]
Orozco, A [1 ]
Knauss, LA [1 ]
机构：
[1] Neocera Inc, Beltsville, MD 20705 USA
来源：
SOLID STATE TECHNOLOGY | 2004年 / 47卷 / 12期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances have enabled magnetic-field imaging to identify high-resistance defects in packaged ICs within a resolution of 20mum on the device. This is done in a noncontact, nondestructive approach for several packaging technologies, including stacked die. For die-level applications, submicron resolution of HR defects can be achieved. High-resolution current mapping is achieved with two types of magnetic microscopes. One is a scanning fiber/superconducting quantum interference device (SQUID) microscope, which uses a SQUID sensor coupled to a nanoscale ferromagnetic probe. The second employs a magnetoresistive sensor.
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页码：55 / +
页数：3
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