Advances in magnetic microscopy for stacked-die and package-level fault isolation

被引：0

作者：

Gaudestad, JO ^{[1
]}

Woods, SI ^{[1
]}

Orozco, A ^{[1
]}

Knauss, LA ^{[1
]}

机构：

[1] Neocera Inc, Beltsville, MD 20705 USA

来源：

SOLID STATE TECHNOLOGY | 2004年 / 47卷 / 12期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Recent advances have enabled magnetic-field imaging to identify high-resistance defects in packaged ICs within a resolution of 20mum on the device. This is done in a noncontact, nondestructive approach for several packaging technologies, including stacked die. For die-level applications, submicron resolution of HR defects can be achieved. High-resolution current mapping is achieved with two types of magnetic microscopes. One is a scanning fiber/superconducting quantum interference device (SQUID) microscope, which uses a SQUID sensor coupled to a nanoscale ferromagnetic probe. The second employs a magnetoresistive sensor.

引用

页码：55 / +

页数：3

共 26 条

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