A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches

被引:68
|
作者
Chun, Ki Chul [1 ]
Jain, Pulkit [1 ]
Lee, Jung Hwa [2 ]
Kim, Chris H. [1 ]
机构
[1] Univ Minnesota, Dept Elect & Comp Engn, Minneapolis, MN 55455 USA
[2] Samsung Elect, Memory Div, DRAM Design Team, Hwasung 445701, Kyeonggi Do, South Korea
关键词
Cache; logic-compatible eDRAM; low-power; low-voltage; 3T gain cell; CURRENT SENSE AMPLIFIER;
D O I
10.1109/JSSC.2011.2128150
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Circuit techniques for enabling a sub-0.9 V logic-compatible embedded DRAM (eDRAM) are presented. A boosted 3T gain cell utilizes Read Word-line (RWL) preferential boosting to increase read margin and improve data retention time. Read speed is enhanced with a hybrid current/voltage sense amplifier that allows the Read Bit-line (RBL) to remain close to VDD. A regulated bit-line write scheme for driving the Write Bit-line (WBL) is equipped with a steady-state storage node voltage monitor to overcome the data '1' write disturbance problem of the PMOS gain cell without introducing another boosted supply for the Write Word-line (WWL) over-drive. An adaptive and die-to-die adjustable read reference bias generator is proposed to cope with PVT variations. Monte Carlo simulations compare the 6-sigma read and write performance of proposed eDRAM against conventional designs. Measurement results from a 64 kb eDRAM test chip implemented in a 65 nm low-leakage CMOS process show a 1.25 ms data retention time with a 2 ns random cycle time at 0.9 V, 85 degrees C, and a 91.3 mu W per Mb static power dissipation at 1.0 V, 85 degrees C.
引用
收藏
页码:1495 / 1505
页数:11
相关论文
共 32 条
  • [21] A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory
    Yoshida, E
    Tanaka, T
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (04) : 692 - 697
  • [22] FinFET based ultra-low power 3T GC-eDRAM with very high retention time in sub-22 nm
    Sany, Bahareh Seyedzadeh
    Ebrahimi, Behzad
    [J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2022, 113 (01) : 27 - 39
  • [23] FinFET based ultra-low power 3T GC-eDRAM with very high retention time in sub-22 nm
    Bahareh Seyedzadeh Sany
    Behzad Ebrahimi
    [J]. Analog Integrated Circuits and Signal Processing, 2022, 113 : 27 - 39
  • [24] 45nm Low Power CMOS Logic Compatible Embedded STT MRAM Utilizing a Reverse-Connection 1T/1MTJ Cell
    Lin, C. J.
    Kang, S. H.
    Wang, Y. J.
    Lee, K.
    Zhu, X.
    Chen, W. C.
    Li, X.
    Hsu, W. N.
    Kao, Y. C.
    Liu, M. T.
    Chen, W. C.
    Lin, YiChing
    Nowak, M.
    Yu, N.
    Tran, Luan
    [J]. 2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, 2009, : 256 - +
  • [25] Methanol to power through high-efficiency hybrid fuel cell system: Thermodynamic, thermo-economic, and techno-economic (3T) analyses in Northwest China
    Wu, Zhen
    Zhu, Pengfei
    Yao, Jing
    Kurko, Sandra
    Ren, Jianwei
    Tan, Peng
    Xu, Haoran
    Zhang, Zaoxiao
    Ni, Meng
    [J]. ENERGY CONVERSION AND MANAGEMENT, 2021, 232
  • [26] High-density low-power-operating DRAM device adopting 6F2 cell scheme with novel S-RCAT structure on 80nm feature size and beyond
    Oh, HJ
    Kim, JY
    Kim, JH
    Park, SG
    Kim, DH
    Kim, SE
    Woo, DS
    Lee, YS
    Ha, GW
    Park, JM
    Kang, NJ
    Kim, HJ
    Hwang, YS
    Kim, BY
    Kim, DI
    Cho, YS
    Choi, JK
    Lee, BH
    Kim, SB
    Cho, MH
    Kim, YI
    Choi, J
    Shin, DW
    Shim, MS
    Choi, WT
    Lee, GP
    Park, YJ
    Lee, WS
    Ryu, BI
    [J]. PROCEEDINGS OF ESSDERC 2005: 35TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2005, : 177 - 180
  • [27] High-density 8Mb 1T-1C ferroelectric random access memory embedded within a low-power 130nm logic process
    Summmerfelt, S. R.
    Moise, T. S.
    Udayakumar, K. R.
    Boku, K.
    Remack, K.
    Rodriguez, J.
    Gertas, J.
    McAdams, H.
    Madan, S.
    Eliason, J.
    Groat, J.
    Kim, D.
    Staubs, P.
    Depner, M.
    Bailey, R.
    [J]. 2007 SIXTEENTH IEEE INTERNATIONAL SYMPOSIUM ON THE APPLICATIONS OF FERROELECTRICS, VOLS 1 AND 2, 2007, : 9 - +
  • [28] LOW VERSUS HIGH-DENSITY OF IMMOBILIZED ANTI-CD3 INFLUENCES IL-4 REGULATION OF T-CELL IMMUNE-RESPONSES
    JONESTIFFANY, LA
    MEHROTRA, PT
    HOROHOV, DW
    SIEGEL, J
    KOZAK, RW
    [J]. CELLULAR IMMUNOLOGY, 1993, 147 (02) : 425 - 437
  • [29] CYTOKINE SYNTHESIS AND APOPTOSIS BY INTESTINAL INTRAEPITHELIAL LYMPHOCYTES - SIGNALING OF HIGH-DENSITY ALPHA-BETA-T-CELL RECEPTOR(+) AND GAMMA-DELTA T-CELL RECEPTOR(+) T-CELLS VIA T-CELL RECEPTOR-CD3 COMPLEX RESULTS IN INTERFERON-GAMMA AND INTERLEUKIN-5 PRODUCTION, WHILE LOW-DENSITY T-CELLS UNDERGO DNA FRAGMENTATION
    YAMAMOTO, K
    FUJIHASHI, K
    AMANO, M
    MCGHEE, JR
    BEAGLEY, KW
    KIYONO, H
    [J]. EUROPEAN JOURNAL OF IMMUNOLOGY, 1994, 24 (06) : 1301 - 1306
  • [30] Resistive switching characteristics of Si3N4-based resistive-switching random-access memory cell with tunnel barrier for high density integration and low-power applications
    Kim, Sungjun
    Jung, Sunghun
    Kim, Min-Hwi
    Cho, Seongjae
    Park, Byung-Gook
    [J]. APPLIED PHYSICS LETTERS, 2015, 106 (21)