3-D electromagnetic analysis of the package influence on the IC performance

被引：0
|
作者：
Nosal, Z [1 ]
Abramowicz, A [1 ]
机构：
[1] Warsaw Univ Technol, Inst Elect Syst, PL-00665 Warsaw, Poland
来源：
MIKON-2000, VOLS 1 & 2, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An integrated circuit package has been analyzed using the 3 dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with the high frequency circuit simulators. Presented results show a necessity of including package properties in the RF and microwave IC design process.
引用
收藏
页码：561 / 564
页数：4
相关论文
共 50 条
  • [31] A Non-Slicing 3-D Floorplan Representation for Monolithic 3-D IC Design
    Das, Shantonu
    Kim, Dae Hyun
    PROCEEDINGS OF THE 2019 20TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2019, : 323 - 328
  • [32] 3-D TOP-A software package for the topological analysis of image sequences
    Kriete, A
    Schwebel, T
    JOURNAL OF STRUCTURAL BIOLOGY, 1996, 116 (01) : 150 - 154
  • [33] Modeling and Analysis of Die-to-Die Vertical Coupling in 3-D IC
    Lee, Sangrok
    Kim, Gawon
    Kim, Jaemin
    Song, Taigon
    Lee, Junho
    Lee, Hyungdong
    Park, Kunwoo
    Kim, Joungho
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 707 - +
  • [34] Microfluidic Cooling for 3D-IC with 3D Printing Package
    Han, Jun-Han
    Torres-Castro, Karina
    West, Robert E.
    Varhue, Walter
    Swami, Nathan
    Stan, Mircea
    2019 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2019,
  • [35] 3D IC technology delivers the total package
    Allan, Roger
    Electronic Design, 2010, 58 (10)
  • [36] Analysis of Alignment Influence on 3-D Anthropometric Statistics
    蔡秀文
    李志忠
    CHANG Chien-Chi
    DEMPSEY Patrick
    Tsinghua Science and Technology, 2005, (05) : 623 - 626
  • [37] 3-d electromagnetic field analysis in heterogeneous media on wavelet basis
    Zakharia, Y
    MODERN PROBLEMS OF RADIO ENGINEERING, TELECOMMUNICATIONS AND COMPUTER SCIENCE, PROCEEDINGS, 2002, : 38 - 41
  • [38] THEORETICAL-ANALYSIS OF 3-D NONLINEAR ELECTROMAGNETIC RESONANT CAVITIES
    ZHOU, LZ
    CHINESE SCIENCE BULLETIN, 1994, 39 (17): : 1413 - 1418
  • [39] Motor Modeling for EMC simulation by 3-D Electromagnetic Field Analysis
    Maki, Kohji
    Funato, Hiroki
    Shao, Liang
    2009 IEEE INTERNATIONAL ELECTRIC MACHINES & DRIVES CONFERENCE, VOLS 1-3, 2009, : 103 - 108
  • [40] An Explicit and Unconditionally Stable FDTD Method for 3-D Electromagnetic Analysis
    Gaffar, Md
    Jiao, Dan
    2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS), 2013,
12345