共 50 条
- [1] IC Packaging: 3D IC Technology and Methods PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NANO-ELECTRONICS, CIRCUITS & COMMUNICATION SYSTEMS, 2017, 403 : 303 - 317
- [2] Microfluidic Cooling for 3D-IC with 3D Printing Package 2019 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2019,
- [3] A Comprehensive Reliability Study on a CoWoS 3D IC Package 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 573 - 577
- [4] Reliability evaluations on 3D IC Package beyond JEDEC 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1517 - 1522
- [5] IC-PACKAGE THERMAL CO-ANALYSIS IN 3D IC ENVIRONMENT PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2, 2012, : 335 - 341
- [7] Material Technology for 2.5D/3D Package IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, : 101 - 104
- [8] Reliability Evaluation of a CoWoS-enabled 3D IC Package 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 35 - 40
- [10] A New Methodology for IC-Package Thermal Co-Analysis in 3D IC Environment 2010 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGE & SYSTEMS SYMPOSIUM, 2010,