3D IC technology delivers the total package

被引:0
|
作者
Allan, Roger
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process
    Khor, Chu Yee
    Abdullah, Mohd Zulkifly
    MAEJO INTERNATIONAL JOURNAL OF SCIENCE AND TECHNOLOGY, 2012, 6 (02) : 159 - 185
  • [32] 3D modeling of electromigration combined with thermal-mechanical effect for IC device and package
    Liu, Yong
    Irving, Scott
    Luk, Timwah
    EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 645 - +
  • [33] 3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package
    Liu, Yong
    Liang, Lihua
    Irving, Scott
    Luk, Timwah
    MICROELECTRONICS RELIABILITY, 2008, 48 (06) : 811 - 824
  • [34] Assembly Challenges in Developing 3D IC Package with Ultra High Yield and High Reliability
    Chaware, Raghunandan
    Hariharan, Ganesh
    Lin, Jeff
    Singh, Inderjit
    O'Rourke, Glenn
    Ng, Kenny
    Pai, S. Y.
    Li, Chien-Chen
    Huang, Zill
    Cheng, S. K.
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1447 - 1451
  • [35] Direct Power Board Bonding Technology for 3D Power Module Package
    Ishibashi, Hidetoshi
    Yoshida, Hiroshi
    Murata, Daisuke
    Morisaki, Shota
    Rokubuichi, Hodaka
    Minamide, Ayumi
    Asaji, Nobuhiro
    2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019), 2019, : 79 - 82
  • [36] High Performance 3D Package Technology for Mobile Application Processor (AP)
    Kim, Sun Jae
    Kim, Cheol
    Jang, Huiyeong
    Hong, Jongpa
    Kim, Seongyo
    Choi, Yongwon
    Jo, Chajea
    Seo, Sun-Kyung
    Kim, Dong Kwan
    Kim, Dae-Woo
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 348 - 352
  • [37] 3D IC technology drives public investment in 300mm
    Toennies, Dietrich
    SOLID STATE TECHNOLOGY, 2009, 52 (10) : 32 - 32
  • [38] Pulsed Laser Annealing: A scalable and practical technology for monolithic 3D IC
    Rajendran, Bipin
    Henning, Albert K.
    Cronquist, Brian
    Or-Bach, Zvi
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [39] 3D printed EV technology packs big punch in small package
    O'Shea, Paul
    Electronic Products, 2015, 57 (02):
  • [40] Bridging the processor-memory performance gap with 3D IC technology
    Liu, CC
    Ganusov, I
    Burtscher, M
    Tiwari, S
    IEEE DESIGN & TEST OF COMPUTERS, 2005, 22 (06): : 556 - 564