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- [22] Design and Package Technology Development of Face-to-Face Die Stacking as a Low Cost Alternative for 3D IC Integration 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 338 - 341
- [23] A Novel 3D IC Wafer-Level-Package for New Wave MEMS 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 603 - 608
- [25] Co-process Technology of the TSV and Embedded IC for 3D heterogeneous IC Integration 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [26] An Industrial Perspective of 3D IC Integration Technology - From the viewpoint of Design Technology 2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010), 2010, : 536 - 537
- [27] Virtual Package Design and Realization Based on 3D Visualization Technology 13TH GLOBAL CONGRESS ON MANUFACTURING AND MANAGEMENT, 2017, 174 : 1336 - 1339
- [29] System-in-a-Package Technology for 3D Integration of Radar Modules MRRS: 2008 MICROWAVES, RADAR AND REMOTE SENSING SYMPOSIUM, PROCEEDINGS, 2008, : 112 - +