3D IC technology delivers the total package

被引:0
|
作者
Allan, Roger
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] 3D IC-Package-Board Co-analysis using 3D EM Simulation for Mobile Applications
    Kostka, Darryl
    Song, Taigon
    Lim, Sung Kyu
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 2113 - 2120
  • [22] Design and Package Technology Development of Face-to-Face Die Stacking as a Low Cost Alternative for 3D IC Integration
    Li, Zhe
    Li, Yuan
    Xie, John
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 338 - 341
  • [23] A Novel 3D IC Wafer-Level-Package for New Wave MEMS
    Huang, Che-Hau
    Schuler-Wakins, Sebastian
    Ou, Ying-Te
    Wang, Yung-Hui
    Reichenbach, Ralf
    Polityko, David
    Hansen, Uwe
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 603 - 608
  • [24] Full stream ahead - A new technology delivers 3D models across the Web
    Mahoney, DP
    COMPUTER GRAPHICS WORLD, 2001, 24 (01) : 14 - +
  • [25] Co-process Technology of the TSV and Embedded IC for 3D heterogeneous IC Integration
    Yook, Jong-Min
    Kim, Seong-Ryul
    Lee, Won-Cheol
    Kim, Dong-Su
    Kim, Jun-Chul
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [26] An Industrial Perspective of 3D IC Integration Technology - From the viewpoint of Design Technology
    Choi, Kyu-Myung
    2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010), 2010, : 536 - 537
  • [27] Virtual Package Design and Realization Based on 3D Visualization Technology
    Wang Zhi-qiang
    13TH GLOBAL CONGRESS ON MANUFACTURING AND MANAGEMENT, 2017, 174 : 1336 - 1339
  • [28] A proactive technology selection model for new technology: The case of 3D IC TSV
    Hung, Chih-Young
    Lee, Wen-Yi
    TECHNOLOGICAL FORECASTING AND SOCIAL CHANGE, 2016, 103 : 191 - 202
  • [29] System-in-a-Package Technology for 3D Integration of Radar Modules
    Brebels, S.
    Sun, X.
    Carchon, G.
    Posada, G.
    Dussopt, L.
    Dubois, M. -A.
    Vandenbosch, G.
    De Raedt, W.
    MRRS: 2008 MICROWAVES, RADAR AND REMOTE SENSING SYMPOSIUM, PROCEEDINGS, 2008, : 112 - +
  • [30] PLM: 3D process simulation delivers
    不详
    CONTROL ENGINEERING, 2008, 55 (09) : 78 - +