3-D electromagnetic analysis of the package influence on the IC performance

被引：0
|
作者：
Nosal, Z [1 ]
Abramowicz, A [1 ]
机构：
[1] Warsaw Univ Technol, Inst Elect Syst, PL-00665 Warsaw, Poland
来源：
MIKON-2000, VOLS 1 & 2, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An integrated circuit package has been analyzed using the 3 dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with the high frequency circuit simulators. Presented results show a necessity of including package properties in the RF and microwave IC design process.
引用
收藏
页码：561 / 564
页数：4
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