Testing Power-Delivery TSVs

被引：0

作者：

Li, Hua-Xuan ^{[1
]}

Fu, Hua-Cheng ^{[1
]}

Huang, Shi-Yu ^{[1
]}

Jiang, Jin-Cheng ^{[2
]}

Kwai, Ding-Ming ^{[3
]}

Chou, Yung-Fa ^{[3
]}

机构：

[1] Natl Tsing Hua Univ, EE Dept, Hsinchu 30013, Taiwan

[2] Natl Tsing Hua Univ, Math Dept, Hsinchu 30013, Taiwan

[3] Ind Technol Res Inst, ICL, Hsinchu, Taiwan

来源：

PROCEEDINGS OF THE SIXTH ASIA SYMPOSIUM ON QUALITY ELECTRONIC DESIGN ASQED 2015 | 2015年

关键词：

TSV; power delivery; Defect; Ring Oscillator; Voltage-Drop; Monitoring;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many TSVs in a 3D IC are not used for signal transmission but for power delivery. Techniques needed to detect them have not been studied in-depth in the literature. In this paper, we present a test method for power-delivery TSVs, by embedding ring-oscillator (RO) based monitors (in a scalable architecture) to detect if there is any excessive voltage-drop at the end of any TSV during a manufacturing test session. One key feature as opposed to previous RO-based methods is that our approach is able to detect the worst-case dynamic voltage-drop (occurring in a very short period of time such as 1ns), rather than just the average voltage-drop over a long period of time. This is essential in order to detect small defects inside the power delivery network. These defects, if not detected, could set off a transient timing failure when the IC is operated in a system.

引用

页码：127 / 131

页数：5

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