FEA evaluation on solder joint reliability of CCGA

被引：0

作者：

Fai, LT ^{[1
]}

机构：

[1] Adv Micro Devices Singapore PTE LTD, Singapore 469028, Singapore

来源：

MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING | 2000年 / 4229卷

关键词：

FEA; CCGA; reliability; solder joint; solder column; creep; fatigue life;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D diagonal sliced models for seven combinations of CCGA package s were built. The FEA results show that, the board level reliability of Package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.

引用

页码：123 / 132

页数：10

共 50 条

[41] Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process
Ming, Lau Hong
Debnath, Sujan
Johar, Mahzan
Asasaari, Siti Faizah Mad
Januddi, Mohd Al Fatihhi Szali
Kosnan, Mohamad Shahrul Effendy
INTERNATIONAL JOURNAL OF ONLINE AND BIOMEDICAL ENGINEERING, 2022, 18 (08) : 142 - 153
[42] Solder joint reliability of lead-free solder balls assembled with SnPb solder paste
Theuss, H
Kilger, T
Ort, T
53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 331 - 337
[43] Impact of solder pad shape on lead-free solder joint reliability
Vasko, Cyril
Novotny, Marek
Szendiuch, Ivan
2008 31ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: RELIABILITY AND LIFE-TIME PREDICTION, 2008, : 443 - 445
[44] Effect on lead-free solder joint reliability caused by solder volume
Yamabe M.
Fukumitsu M.
Fukuchi Y.
Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2010, 79 (03): : 16 - 21
[45] A study of solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
Zheng, PJ
Lee, JZ
Liu, KH
Wu, JD
Hung, SC
2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 129 - 138
[46] CCGA design variables and their effects on reliability
Cole, Marie S.
Ingalls, Ellyn
Martin, Gregory B.
Milkovich, Cynthia
Circuits Assembly, 2002, 13 (01): : 66 - 72
[47] Solder joint reliability risk estimation by AI modeling
Yuan, Cadmus
Lee, Chang-Chi
2020 21ST INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2020,
[48] A review and prediction of chip scale solder joint reliability
Ghaffarian, R
1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 109 - 110
[49] Solder Joint Encapsulation and Reliability using Dippable Underfill
Yeo, Yen Chen
Huang, Mark
Che, Fa Xing
Chong, Ser Choong
Lim, Keith Cheng Sing
Thew, Serene
Vasarla, Nagendra Sekhar
Gao, Shan
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 710 - 714
[50] A slim sector model for the analysis of solder joint reliability
Zhao, B
Tay, AAO
6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 522 - 525

← 1 2 3 4 5 →