FEA evaluation on solder joint reliability of CCGA

被引：0

作者：

Fai, LT ^{[1
]}

机构：

[1] Adv Micro Devices Singapore PTE LTD, Singapore 469028, Singapore

来源：

MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING | 2000年 / 4229卷

关键词：

FEA; CCGA; reliability; solder joint; solder column; creep; fatigue life;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D diagonal sliced models for seven combinations of CCGA package s were built. The FEA results show that, the board level reliability of Package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.

引用

页码：123 / 132

页数：10

共 50 条

[31] EFFECTS OF VOIDS ON SMT SOLDER JOINT RELIABILITY
LAU, JH
JEANS, AH
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 177 - 187
[32] Inconsistencies in the understanding of solder joint reliability physics
Wen, L
Mon, GR
Ross, RG
DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 219 - 228
[33] Study on No-fillet SMT Solder Joint Reliability Based on Solder Joint Shape CAD
Wu ZhaoHua
Zhou DeJian
Huang ChunYue
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 431 - +
[34] Solder joint lifetime model using AI framework operating on FEA data
Akhtar, Mohd Zubair
Schmid, Maximilian
Zippelius, Andreas
Elger, Gordon
ENGINEERING FAILURE ANALYSIS, 2025, 167
[35] Dispersion and Evaluation of Thermal Fatigue Reliability for Solder Joint by Using Normal Random Numbers
Maruoka, Toshiaki
Yu, Qiang
Shibutani, Tadahiro
2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, : 422 - 428
[36] CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis
Pang, JHL
Seetoh, CW
Wang, ZP
JOURNAL OF ELECTRONIC PACKAGING, 2000, 122 (03) : 255 - 261
[37] Evaluation of solder joint reliability in flip chip package under thermal shock test
Kim, DG
Kim, JW
Jung, SB
THIN SOLID FILMS, 2006, 504 (1-2) : 426 - 430
[38] Evaluation of solder joint reliability in flip-chip packages during accelerated testing
Kim, JW
Kim, DG
Hong, WS
Jung, SB
JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (12) : 1550 - 1557
[39] Evaluation and optimization of package processing, design, and reliability through solder joint profile prediction
Yeung, BH
Lee, TYT
51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 925 - 930
[40] Evaluation of solder joint reliability in flip-chip packages during accelerated testing
Jong-Woong Kim
Dae-Gon Kim
Won Sik Hong
Seung-Boo Jung
Journal of Electronic Materials, 2005, 34 : 1550 - 1557

← 1 2 3 4 5 →