FEA evaluation on solder joint reliability of CCGA

被引：0

作者：

Fai, LT ^{[1
]}

机构：

[1] Adv Micro Devices Singapore PTE LTD, Singapore 469028, Singapore

来源：

MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING | 2000年 / 4229卷

关键词：

FEA; CCGA; reliability; solder joint; solder column; creep; fatigue life;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D diagonal sliced models for seven combinations of CCGA package s were built. The FEA results show that, the board level reliability of Package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.

引用

页码：123 / 132

页数：10

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