Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

被引：40

作者：

Yan, Jianfeng ^{[1
]}

Zou, Guisheng ^{[1
]}

Wu, Aiping ^{[1
]}

Ren, Jialie ^{[1
]}

Hu, Anming ^{[2
]}

Zhou, Y. Norman ^{[1
,2
]}

机构：

[1] Tsinghua Univ, Dept Mech Engn, Key Lab Adv Mfg Mat Proc Technol, Minist Educ PR China, Beijing 100084, Peoples R China

[2] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2012年 / 41卷 / 07期

基金：

中国国家自然科学基金;

关键词：

Cu-Ag mixed NPs; lead-free; low-temperature bonding; electronics packaging; SILVER; GOLD; LEAD; ELECTROMIGRATION; ELECTRONICS; TECHNOLOGY; COPPER;

D O I：

10.1007/s11664-012-2008-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple method has been proposed to prepare polymer-protected Cu-Ag mixed nanoparticles (NPs), which are suitable for use as low-temperature bonding materials. The polymer coated on the Cu-Ag mixed NPs can protect them from oxidation effectively when heated in air at temperature lower than 280A degrees C. The low-temperature bonding process utilizing Cu-Ag mixed NPs as the bonding material is investigated. The bonding experiments show that robust joints are formed using Cu-Ag mixed NPs at 160A degrees C in air. The shear test shows that addition of copper to silver is helpful for improving joint strength. This novel sintering-bonding technology using Cu-Ag mixed NPs as an interconnection material has potential for application in the electronics packaging industry.

引用

页码：1886 / 1892

页数：7

共 50 条

[21] Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding
Park, S. W.
Sugahara, T.
Hatamura, M.
Kagami, N.
Sakamoto, S.
Nagao, S.
Suganuma, K.
MATERIALS LETTERS, 2015, 151 : 68 - 71
[22] A hybrid bonding interconnection with a novel low-temperature bonding polymer system
Lin, Yu-Min
Chang, Po-Chih
Lee, Ou-Hsiang
Chiu, Wei-Lan
Chang, Tao-Chih
Chang, Hsiang-Hung
Lee, Chia-Hsin
Huang, Baron
Dong, Mei
Tsai, Duo
Lee, Chang-Chun
Chen, Kuan-Neng
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2128 - 2134
[23] Investigation of bonding mechanism for low-temperature Cu-Cu bonding with passivation layer
Hong, Zhong-Jie
Liu, Demin
Hu, Han-Wen
Cho, Chih-, I
Weng, Ming-Wei
Liu, Jui-Han
Chen, Kuan-Neng
APPLIED SURFACE SCIENCE, 2022, 592
[24] Large-scale bare Cu bonding by 10 gm-sized Cu-Ag composite paste in low temperature low pressure air conditions
Chen, Chuantong
Zhao, Shuaijie
Sekiguchi, Takuya
Suganuma, Katsuaki
JOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES, 2023, 8 (03):
[25] Low Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes
Ma, Chaoli
Xue, Songbai
Bridges, Denzel
Palmer, Zane
Feng, Zhili
Hu, Anming
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 721 : 431 - 439
[26] A low-temperature solid-state bonding method using Ag-modified Cu microcones and Ag buffer
Sun, Menglong
Hu, Fengtian
Ju, Longlong
Hu, Anmin
Li, Ming
Ling, Huiqin
Hang, Tao
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 36 - 36
[27] The Mechanisms of Oxygen Accelerated Low-Temperature Bonding by Ag Nanoparticles
Wang, Wengan
Zou, Guisheng
Chen, Na
Jia, Qiang
Feng, Bin
Zhang, Hongqiang
Deng, Zhongyang
Liu, Lei
PARTICLE & PARTICLE SYSTEMS CHARACTERIZATION, 2023, 40 (07)
[28] Low-temperature Cu-Cu bonding by self-reduction of particle-free Ag ion paste
Li, Junjie
Shi, Tielin
Liao, Guanglan
Tang, Zirong
2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 422 - 425
[29] Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes
Xue, Songbai (xuesb@nuaa.edu.cn), 1600, Elsevier Ltd (721):
[30] Cu-Cu Bonding by Ag Nanostructure at Low Temperature of 180 °C
Liu, Ziyu
Wang, Qian
Cai, Jian
Zou, Guisheng
Liu, Lei
Shen, Daozhi
Tan, Lin
2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,

← 1 2 3 4 5 →