Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

被引：40

作者：

Yan, Jianfeng ^{[1
]}

Zou, Guisheng ^{[1
]}

Wu, Aiping ^{[1
]}

Ren, Jialie ^{[1
]}

Hu, Anming ^{[2
]}

Zhou, Y. Norman ^{[1
,2
]}

机构：

[1] Tsinghua Univ, Dept Mech Engn, Key Lab Adv Mfg Mat Proc Technol, Minist Educ PR China, Beijing 100084, Peoples R China

[2] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2012年 / 41卷 / 07期

基金：

中国国家自然科学基金;

关键词：

Cu-Ag mixed NPs; lead-free; low-temperature bonding; electronics packaging; SILVER; GOLD; LEAD; ELECTROMIGRATION; ELECTRONICS; TECHNOLOGY; COPPER;

D O I：

10.1007/s11664-012-2008-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple method has been proposed to prepare polymer-protected Cu-Ag mixed nanoparticles (NPs), which are suitable for use as low-temperature bonding materials. The polymer coated on the Cu-Ag mixed NPs can protect them from oxidation effectively when heated in air at temperature lower than 280A degrees C. The low-temperature bonding process utilizing Cu-Ag mixed NPs as the bonding material is investigated. The bonding experiments show that robust joints are formed using Cu-Ag mixed NPs at 160A degrees C in air. The shear test shows that addition of copper to silver is helpful for improving joint strength. This novel sintering-bonding technology using Cu-Ag mixed NPs as an interconnection material has potential for application in the electronics packaging industry.

引用

页码：1886 / 1892

页数：7

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