A low-temperature solid-state bonding method using Ag-modified Cu microcones and Ag buffer

被引：0

作者：

Sun, Menglong ^{[1
]}

Hu, Fengtian ^{[1
]}

Ju, Longlong ^{[1
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

Ling, Huiqin ^{[1
]}

Hang, Tao ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China

来源：

2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2017年

基金：

中国国家自然科学基金;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel low-temperature solid-state bonding method that Cu microcones coated with Ag and Ag buffer has been proposed. Thin Ag layer was used to prevent the oxidation of Cu microcones and Ag layer of several micrometers was used as a buffer layer between Cu microcones and Cu bumps. No brittle IMCs formed in the interfaces.

引用

页码：36 / 36

页数：1

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