Post CMP cleaning using a novel HF compatible high power magasonic tank

被引:2
|
作者
Tardif, F
Lardin, T
Constant, I
Fayolle, M
Boelen, P
Cowache, C
Kashkoush, I
Novak, R
机构
[1] CEAG, DMEL, CEA Technol Avancees, LETI, F-38054 Grenoble 9, France
[2] SubMicron Syst Inc, Allentown, PA 18106 USA
关键词
cleaning; backend; megasonics; CMP; HF;
D O I
10.4028/www.scientific.net/SSP.65-66.169
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A novel high power megasonic tank was successfully tested for backend cleaning applications. The use of diluted HF-based chemistries coupled with megasonics enables the same low residual particle levels obtained by scrubbing to be achieved at lower cost.
引用
收藏
页码:169 / 172
页数:4
相关论文
共 50 条
  • [1] Novel post CMP cleaning using buffered HF solution and ozone water
    Yeh, CF
    Hsiao, CW
    Lee, WS
    [J]. APPLIED SURFACE SCIENCE, 2003, 216 (1-4) : 46 - 53
  • [2] Post-CMP cleaning using acoustic streaming
    Busnaina, AA
    Elsawy, TM
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (10) : 1095 - 1098
  • [3] Post-CMP cleaning using acoustic streaming
    Ahmed A. Busnaina
    T. M. Elsawy
    [J]. Journal of Electronic Materials, 1998, 27 : 1095 - 1098
  • [4] A novel design of brush scrubbing in post-CMP cleaning
    Qi, Zuqiang
    Lu, Wanjia
    Lee, Weiming
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2014, 85 : 30 - 35
  • [5] Study on Different Surfactants for Post CMP Cleaning of Novel Barrier
    Tian, Siyu
    Tan, Baimei
    Wang, Qi
    Han, Chunyu
    Yang, Liu
    Gao, Baohong
    [J]. 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2019,
  • [6] NOVEL POST CLEANING SOLUTIONS FOR NEXT GENERATION CU CMP APPLICATION
    Ko, Lennon
    Chen, Jesse
    Liu, Vincent
    Wu, K. C.
    [J]. CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 619 - 624
  • [7] Efficient, high-throughput post-STI CMP cleaning
    Black, Andrew
    Liu, Albert H.
    Jiang, Linda T.
    Hymes, Diane
    [J]. 2000, PennWell Publ Co, Nashua, NH, United States (43)
  • [8] Efficient, high-throughput post-STI CMP cleaning
    Black, A
    Liu, AH
    Jiang, LT
    Hymes, D
    [J]. SOLID STATE TECHNOLOGY, 2000, 43 (12) : 96 - +
  • [9] A Post-Si CMP Cleaning Using BDD Film Electrochemical Oxidation
    Zhu, Yadong
    Yang, Xiaoping
    Gao, Baohong
    [J]. ADVANCES IN CHEMICAL, MATERIAL AND METALLURGICAL ENGINEERING, PTS 1-5, 2013, 634-638 : 169 - 172
  • [10] A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning
    邓海文
    檀柏梅
    高宝红
    王辰伟
    顾张冰
    张燕
    [J]. Journal of Semiconductors, 2015, 36 (10) : 163 - 167