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- [21] Non-contact post-CMP cleaning using a single wafer processing system CHEMICAL MECHANICAL PLANARIZATION IN INTEGRATED CIRCUIT DEVICE MANUFACTURING, 1998, 98 (07): : 81 - 89
- [22] Using real-time defect classification to investigate post-CMP cleaning processes MICRO, 2002, 20 (09): : 63 - +
- [23] Post oxide etching cleaning process using integrated ashing and HF vapor process ENVIRONMENTAL ISSUES WITH MATERIALS AND PROCESSES FOR THE ELECTRONICS AND SEMICONDUCTOR INDUSTRIES V, 2002, 2002 (15): : 166 - 179
- [25] Modeling of particle removal using non-contact brush scrubbing in post-CMP cleaning processes Journal of Adhesion, 2006, 82 (06): : 555 - 575
- [26] Modeling of particle removal using non-contact brush scrubbing in post-CMP cleaning processes JOURNAL OF ADHESION, 2006, 82 (06): : 555 - 575
- [27] Single wafer non-contact post-CMP cleaning using DI water and dilute chemistry CHEMICAL MECHANICAL PLANARIZATION IN IC DEVICE MANUFACTURING III, PROCEEDINGS, 2000, 99 (37): : 468 - 476
- [30] A novel trench formation and planarization technique using positive etching and CMP for smart power ICs ISPSD '98 - PROCEEDINGS OF THE 10TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 1998, : 367 - 370