NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs

被引：0
|
作者：
Lee, Yu-Min [1 ]
Wu, Tsung-Heng [1 ]
Huang, Pei-Yu [2 ]
Yang, Chi-Ping [1 ]
机构：
[1] Natl Chiao Tung Univ, Hsinchu, Taiwan
[2] Ind Technol Res Inst, Hsinchu, Taiwan
来源：
DESIGN, AUTOMATION & TEST IN EUROPE | 2013年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
引用
收藏
页码：1379 / 1384
页数：6
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