On Vertex Cover with Fractional Fan-Out Bound

被引:0
|
作者
Fujita, Satoshi [1 ]
机构
[1] Hiroshima Univ, Dept Informat Engn, Higashihiroshima 7398527, Japan
关键词
Minimum weight vertex cover problem; computational complexity; APX-hardness; APPROXIMATION; COMPLEXITY; GRAPHS; TREE;
D O I
10.1109/CANDAR.2014.10
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we consider a new variant of the minimum weight vertex cover problem (MWVC) in which each vertex can cover a fractional amount of edges incident on it. For example, if the degree of a vertex is five and the designated fraction is 2/3, then it can cover at most [(2/3) x 5] = 4 edges among five incident edges. This problem is motivated by a sustainable monitoring of the environment by a set of agents placed at the vertices of graph G so that the failure of agents can be easily recovered by its nearby agents within a short time. This paper investigates the computational complexity of this optimization problem. More specifically, we show that the number of vertices of odd degree, denoted as n(o), plays a key role in determining the hardness of the problem, so that when the given fraction is 1/2, the complexity of the problem increases as n(o) increases, i.e., it can be solved in polynomial time when n(o) = O(1), although it cannot be approximated within an arbitrary constant factor when n(o) = n, where n is the total number of vertices in the given graph.
引用
收藏
页码:68 / 75
页数:8
相关论文
共 50 条
  • [31] Material Innovations for advancements in fan-out packaging
    Yess, Kim
    SOLID STATE TECHNOLOGY, 2018, 61 (04) : 14 - 19
  • [32] Quantum addition circuits and unbounded fan-out
    Takahashi, Yasuhiro
    Tani, Seiichiro
    Kunihiro, Noboru
    Quantum Information and Computation, 2010, 10 (9-10): : 872 - 890
  • [33] Fan-out ultrasound transducer array in substrate
    Lu, Yao
    Wan, Lixi
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 451 - 460
  • [34] Refactoring and its Relationship with Fan-in and Fan-out: An Empirical Study
    Urgia, A. M.
    Tonelli, R.
    Marchesi, M.
    Concas, G.
    Counsell, S.
    McFall, J.
    Swift, S.
    2012 16TH EUROPEAN CONFERENCE ON SOFTWARE MAINTENANCE AND REENGINEERING (CSMR), 2012, : 63 - 72
  • [35] FAST DC COUPLED ANALOGUE FAN-IN AND FAN-OUT MODULES
    HERBST, LJ
    NUCLEAR INSTRUMENTS & METHODS, 1969, 70 (02): : 185 - &
  • [36] Quantum Fan-out: Circuit Optimizations and Technology Modeling
    Gokhale, Pranav
    Koretsky, Samantha
    Huang, Shilin
    Majumder, Swarnadeep
    Drucker, Andrew
    Brown, Kenneth R.
    Chong, Frederic T.
    2021 IEEE INTERNATIONAL CONFERENCE ON QUANTUM COMPUTING AND ENGINEERING (QCE 2021) / QUANTUM WEEK 2021, 2021, : 276 - 290
  • [37] Fan-Out Packaging with Thin-film Inductors
    Boon, Soh Siew
    Wee, Ho Soon
    Boon, Simon Lim Siak
    Siang, Sharon Lim Pei
    Singh, Ravinder Pal
    Raju, Salahuddin
    2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2020, : 449 - 452
  • [38] Advanced System in Package with Fan-out Chip on Substrate
    Lin, Yuan-Ting
    Hsieh, Brian C. C.
    Lou, J. W.
    Chen, Eatice
    Wang, Chiyu
    Tsai, Lung
    Hsieh, Adren
    2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2015, : 273 - 276
  • [39] InFO (Wafer Level Integrated Fan-Out) Technology
    Tseng, Chien-Fu
    Liu, Chung-Shi
    Wu, Chi-Hsi
    Yu, Douglas
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1 - 6
  • [40] CPI Advancement in Integrated Fan-Out (InFO) Technology
    Yu, Douglas
    Yeh, John
    Lin, Tsung-Shu
    Yee, K. C.
    2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,