Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique

被引：6
|
作者：
Wang, WJ [1 ]
Lin, RM
Ren, Y
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Ctr Mech Microsyst, Singapore, Singapore
[2] Nanyang Technol Univ, Sch Mech & Prod Engn, Tissue Engn Lab, Singapore, Singapore
来源：
MICROELECTRONICS INTERNATIONAL | 2003年 / 20卷 / 03期
关键词：
silicon; design; fabrication; electrical machines;
D O I：
10.1108/13565360310487936
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A single wafer silicon condenser microphone with a novel single deeply corrugated diaphragm is presented in this paper. The microphone diaphragm with corrugation depth of 100 mum is only 1 mm(2) in area, while the open-circuit sensitivity as high as 9.8 mV/Pa under a bias voltage of 6 V has been obtained. The recorded frequency bandwidth is about 20 kHz. The measurements show reasonable agreements with the theoretical predictions.
引用
收藏
页码：36 / 40
页数：5
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