A Study on the 3D-TSV Interconnection using Wafer-Level Non-Conductive Adhesives (NCAs)

被引：0
|
作者：
Choi, Yongwon [1 ]
Shin, Jiwon [1 ]
Paik, Kyung-Wook [1 ]
机构：
[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
来源：
2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2011年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the chip to chip eutectic bonding method of TSV stacking using various NCAs are investigated as an alternative chip to chip/wafer interconnection method for 3D-TSV application. The non-conductive polymer adhesives so called, TSV Conductive Adhesives (TCAs), are applied on the chip/wafer before bonding so that it acts like both adhesive and underfill. No additional underfill process is needed. The effects of material properties of TCAs such as curing behavior, and viscosity on the joint formation for 3D-TSV chip interconnection are investigated.
引用
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页码：1126 / 1129
页数：4
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