Effect of the oxygen flow rate on the structure and the properties of Ag-Cu-O sputtered films deposited using a Ag/Cu target with eutectic composition

被引:31
|
作者
Pierson, J. F. [1 ]
Rolin, E. [1 ]
Clement-Gendarme, C. [1 ]
Petitjean, C. [1 ]
Horwat, D. [1 ]
机构
[1] Ecole Mines, CNRS, UMR 7570, Lab Sci & Genie Surfaces, F-54042 Nancy, France
关键词
reactive sputtering; nanostructured films; structure; silver-copper oxides; electrical properties;
D O I
10.1016/j.apsusc.2008.04.026
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Ag-Cu-O films were deposited on glass substrates by reactive sputtering of a composite Ag(60)Cu(40) target in various Ar-O(2) mixtures. The films were characterised by energy dispersive X-ray analysis, X-ray diffraction, UV-visible spectroscopy and using the four point probe method. The structure of the. lms is strongly dependent on the oxygen flow rate introduced in the deposition chamber. The variation of the oxygen flow rate allows the deposition of the following structures: Ag-Cu-(O) solid solution, nc-Ag + nc-Cu(2)O, nc-Ag + nc-(Ag,Cu)(2)O and finally X-ray amorphous. UV-visible reflectance measurements confirm the occurrence of metallic silver into the deposited. lms. The increase of the oxygen flow rate induces a continuous increase of the film oxygen concentration that can be correlated to the evolution of the film reflectance and the film electrical resistivity. Finally, the structural changes vs. the oxygen content are discussed in terms of reactivity of sputtered atoms with oxygen. (C) 2008 Elsevier B. V. All rights reserved.
引用
收藏
页码:6590 / 6594
页数:5
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