The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis

被引：0

作者：

Archambeault, B ^{[1
]}

Connor, S ^{[1
]}

机构：

[1] IBM Corp, Res Triangle Pk, NC USA

来源：

EMC 2005: IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, PROCEEDINGS | 2005年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper demonstrates the effect of decoupling capacitor distance on the amount of EMI noise created at an IC's power pin. As the distance is increased, the amplitude of the noise is increased if the capacitor has been attached to the printed circuit board (PCB) with a low inductance connection. This effect is most apparent when the dielectric thickness of the PCB is greater. Furthermore, this paper demonstrates the need to do this type of analysis in the time domain and not the frequency domain.

引用

页码：650 / 654

页数：5

共 50 条

[41] Transient analysis of printed circuit board structures using a time domain solution of Kirchoff's network equations
Railton, CJ
Ma, LZ
[J]. INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC COMPATIBILITY, 1997, (445): : 113 - 118
[42] Transient analysis of printed circuit board layouts using a time domain solution of Kirchoff's network equations
Goh, CSL
Railton, CJ
[J]. 27TH EUROPEAN MICROWAVE 97, CONFERENCE + EXHIBITION - BRIDGING THE GAP BETWEEN INDUSTRY AND ACADEMIA, VOLS I AND II, 1997, : 550 - 555
[43] Frequency- and Time-Domain Yield Optimization of a Power Delivery Network Subject to Large Decoupling Capacitor Tolerances
Edna Moreno-Mojica, Aurea
Ernesto Rayas-Sanchez, Jose
[J]. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2022, 41 (12) : 5610 - 5620
[44] Analysis on the time and frequency domain for the RC electric circuit of fractional order
Guia, Manule
Gomez, Francisco
Rosales, Juan
[J]. CENTRAL EUROPEAN JOURNAL OF PHYSICS, 2013, 11 (10): : 1366 - 1371
[45] Modeling and Measurement of Board-level ESD from Power/Ground Plane Charged by Low-voltage for Investigation of Decoupling Capacitor Effects in Printed Circuit Boards (PCBs)
Sung, Hajin
Kim, Myunghoi
Lee, Woojin
Yoon, Changwook
Koo, Kyoungchoul
Kwon, Jonghwa
Kim, Joungho
[J]. 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 773 - 776
[46] Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards
Zhang, Mu-Shui
Tan, Hong-Zhou
Mao, Jun-Fa
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (05): : 882 - 891
[47] Analysis of the kinetics of electrochemical migration on printed circuit boards using Nernst-Planck transport equation
He, Xiaofei
Azarian, Michael H.
Pecht, Michael G.
[J]. Electrochimica Acta, 2014, 142 : 1 - 10
[48] Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters
de Paulis, Francesco
Zhang, Yao-Jiang
Fan, Jun
[J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (04) : 1008 - 1018
[49] Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation
He, Xiaofei
Azarian, Michael H.
Pecht, Michael G.
[J]. ELECTROCHIMICA ACTA, 2014, 142 : 1 - 10
[50] Environmental and economic performance analysis of recycling waste printed circuit boards using life cycle assessment
Pokhrel, Prakash
Lin, Sheng-Lung
Tsai, Chi-Ting
[J]. JOURNAL OF ENVIRONMENTAL MANAGEMENT, 2020, 276 (276)

← 1 2 3 4 5 →