The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis

被引:0
|
作者
Archambeault, B [1 ]
Connor, S [1 ]
机构
[1] IBM Corp, Res Triangle Pk, NC USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates the effect of decoupling capacitor distance on the amount of EMI noise created at an IC's power pin. As the distance is increased, the amplitude of the noise is increased if the capacitor has been attached to the printed circuit board (PCB) with a low inductance connection. This effect is most apparent when the dielectric thickness of the PCB is greater. Furthermore, this paper demonstrates the need to do this type of analysis in the time domain and not the frequency domain.
引用
收藏
页码:650 / 654
页数:5
相关论文
共 50 条
  • [21] Effect of Heating Profile on Printed Circuit Boards using Shadow Moire and Simulations
    Oon, Sim Jui
    Tan, Khai Shiang
    Tou, Teck Yong
    Yap, Seong Shan
    Lau, Chun Sean
    Chin, Yoong Tatt
    [J]. PROCEEDINGS OF THE 14TH ASIA-PACIFIC PHYSICS CONFERENCE, 2021, 2319
  • [22] SETUP TIME MINIMIZATION IN ASSEMBLING PRINTED CIRCUIT BOARDS USING MATHEMATICAL PROGRAMMING MODELS
    Aohara, Masato
    Morikawa, Katsumi
    Nagasawa, Keisuke
    Takahashi, Katsuhiko
    [J]. ICIM'2016: PROCEEDINGS OF THE 13TH INTERNATIONAL CONFERENCE ON INDUSTRIAL MANAGEMENT, 2016, : 374 - 381
  • [23] Determination of Reverberation Distance using Frequency and Time domain
    Rajamani, Vignesh
    Bunting, Charles F.
    [J]. 2010 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC 2010), 2010, : 547 - 551
  • [24] RCS frequency response of printed-circuit-boards in a GTEM cell using the method of moments
    Pouhe, David
    [J]. 2006 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, PROCEEDINGS, 2006, : 603 - 608
  • [25] Rapid Inverse Modeling of Integrated Circuit Layout in Both Frequency and Time Domain
    Xue, Li
    Jiao, Dan
    [J]. 2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2019, : 117 - 120
  • [26] Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation
    Falk, Alexandru
    Marsavina, Liviu
    Pop, Octavian
    [J]. FRATTURA ED INTEGRITA STRUTTURALE, 2020, Gruppo Italiano Frattura (51): : 541 - 551
  • [27] Statistical Analysis of Fiber Weave Effect over Differential Microstrips on Printed Circuit Boards
    Zhang, Tong
    Chen, Xu
    Schutt-Aine, Jose E.
    Cangellaris, Andreas C.
    [J]. 2014 IEEE 18TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2014,
  • [28] Extraction of frequency characteristics of switched-capacitor circuits using time-domain analysis
    Andrejevic, M
    Milovanovic, D
    Petkovic, P
    Litovski, V
    [J]. 2002 23RD INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS, 2002, : 635 - 638
  • [29] Power Noise Suppression in Multilayer Printed Circuit Boards Using Electromagnetic Bandgap in Both Power and Ground Planes
    Zhang, Mu-Shui
    Mao, Jun-Fa
    Tan, Hong-Zhou
    [J]. 2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [30] Modelling the Effect of the DC Link Decoupling Capacitor of a Commutation Power Loop Using a Thevenin-Based Frequency Domain Approach
    Ajiboye, Ayooluwa
    Gamwari, Ayodhya Somiruwan
    Resalayyan, Rakesh
    Khaligh, Alireza
    [J]. 2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, 2024, : 645 - 652