Analysis of 3D conjugate heat transfer in electronic boards: Interaction between three Integrated Circuits

被引：0

作者：

Fourka, B ^{[1
]}

Saulnier, JB ^{[1
]}

机构：

[1] ENSMA, URA CNRS 1403, Lab Etud Therm, F-86960 Futuroscope, France

来源：

THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II | 1997年

关键词：

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

A numerical study is performed by a multigrid technique, to simulate the combined heat transfer conduction/laminar convection in a three-dimensional channel, with three protruding heated integrated circuits (ICs). The effects of the variation of the streamwise spacing between the ICs on the conjugate heat transfer have been studied through the evolution of the velocity, the temperature, the Nusselt number and heat flux fields.

引用

页码：63 / 72

页数：10

共 50 条

[1] Analysis of 3D conjugate heat transfers in electronics
Fradin, JP
Molla, L
Desaunettes, B
EUROPEAN DESIGN & TEST CONFERENCE - ED&TC 97, PROCEEDINGS, 1997, : 190 - 194
[2] Scalable 3D Silicon Photonic Electronic Integrated Circuits and Their Applications
Zhang, Yu
Samanta, Anirban
Shang, Kuanping
Yoo, S. J. Ben
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2020, 26 (02)
[3] 3D moulded circuits stronger than boards
Shelley, Tom
Eureka, 1995, 15 (10) : 57 - 58
[4] Large Scale 3D Topology Optimization of Conjugate Heat Transfer
Sun, Sicheng
Liebersbach, Piotr
Qian, Xiaoping
PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019), 2019, : 1 - 6
[5] A 3D conjugate heat transfer model for continuous wire casting
Blase, TA
Guo, ZX
Shi, Z
Long, K
Hopkins, WG
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2004, 365 (1-2): : 318 - 324
[6] An analysis of conjugate heat transfer in the heat sink of an electronic chip
Horvat, A
Catton, I
STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING, 2002, 48 (09): : 482 - 490
[7] A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
Salvi, Swapnil S.
Jain, Ankur
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (05): : 802 - 821
[8] An Overview of 3D Integrated Circuits
Kumar, Vachan
Naeemi, Azad
2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO), 2017, : 311 - 313
[9] Monolithic 3D integrated circuits
Wong, Simon
El-Gamal, Abbas
Griffin, Peter
Nishi, Yoshio
Pease, Fabian
Plummer, James
2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 66 - +
[10] Advances in 3D Integrated Circuits
Patti, Robert
ISPD 11: PROCEEDINGS OF THE 2011 ACM/SIGDA INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2011, : 79 - 79

← 1 2 3 4 5 →